COB (Chip On Board): Fix the IC die on the printed circuit board by bonding. (Chip On Board Package)

Bonding is the transliteration of the English "bonding". It is a wire bonding method in the chip production process. It is generally used to connect the internal circuit of the chip to the package pins with gold wires before packaging. Generally, after bonding (that is, after the circuit and the pins are connected), the chip is packaged with black glue. At the same time, the advanced outer packaging technology COB is adopted. The process of this process is to implant the tested wafer on a special circuit board. Then use gold wires to connect the wafer circuit to the circuit board, and then cover the melted organic material with a special protective function on the wafer to complete the post-package of the chip.